A selection of our customers:
25-APR-2017 to 27-APR-2017:
Nepcon CHINA - Vist ASTER during NEPCON exibition on Booth 1N14 (Shanghai, China)
14-FEB-2017 to 16-FEB-2017:
APEX EXPO - ASTER Technologies are exhibiting at the APEX EXPO in San Diego between February 14th - 16th, 2017. So why not visit booth 3844 during the show, when we can discuss your requirements and demonstrate the many features of our analysis tools. (San Diego, USA)
08-NOV-2016 to 11-NOV-2016:
ASTER announces the first system level PCB viewer integrated with National Instruments TestStand.
So why not visit the booth A1 352 when we can discuss your requirements and demonstrate our DfX & test coverage analysis tools.
12-SEP-2016 to 15-SEP-2016:
Autotestcon - ASTER Technologies are exhibiting at Autotestcon on booth 1004 (Anaheim, USA)
26-APR-2016 to 28-APR-2016:
Nepcon CHINA - Vist ASTER during NEPCON exibition on Booth 1N17 (Shanghai, China)
15-MAR-2016 to 17-MAR-2016:
IPC APEX EXPO - Pleasevisit us at booth 1651 (Las vegas, USA)
March 2016 - Newsletter n.14: Visit ASTER at IPC APEX EXPO 2016 Show in Las Vegas
TestWay news 2015
November 2015 - Newsletter n.12: Visit ASTER at the AUTOTESTCON 2015 Show in Maryland, USA
10-NOV-2015 to 13-NOV-2015:
Productronica - Visit ASTER at Productronoca, Hall A1, Booth 232. Information & registration (Munich, Germany)
03-NOV-2015 to 05-NOV-2015:
IEEE AUTOTESTCON - Visit ASTER at the IEEE AutoTestCon, Booth 431. Information & registration. Press release (National Harbor, USE)
21-APR-2015 to 23-APR-2015:
Nepcon CHINA - Vist ASTER during NEPCON exibition on Booth B-1J14 (Shanghai, China)
24-FEB-2015 to 26-FEB-2015:
IPC APEX EXPO - ASTER Technologies are exhibiting at APEX Expo between February 24th - 26th, 2015, Booth 415. So why not visit the booth during the show, when we can discuss your requirements and demonstrate the many features of our analysis tools. (San Diego, USA)
11-NOV-2014 to 14-NOV-2014:
Electronica - ASTER Technologies are exhibiting at Electronica.
So why not visit the booth A1 352 when we can discuss your requirements and demonstrate our DfX & test coverage analysis tools. Read more …with our press release. (Munich, Germany)
23-APR-2014 to 25-APR-2014:
Nepcon CHINA - Vist ASTER during NEPCON exibition on Booth A1-1E85 (Shanghai, China)
25-MAR-2014 to 27-MAR-2014:
IPC APEX EXPO - Booth 607 (Las vegas, USA)
WildScan: Boundary-Scan test migration with ICT
WildScan analyzes the following test sequences:
WildScan enables migration of Boundary-Scan
test (BST) program to In-Circuit testers (ICT) without the need for
complementary hardware integration within the target In-Circuit testers. This
significantly reduces test fixturing costs by utilizing the same test fixture
for both Boundary-Scan and In-circuit testing, providing a one-stop test
- Infrastructure test.
- Interconnections test.
- Cluster tests.
- In-system configuration of EPLD and the FPGA devices (excluding components that
require specific programming algorithms or data pulling, ie: FLASH EPROM).
A complete set of test sequences that include Boundary-Scan test bus
(TDI, TDO, TCK, TMS) test vectors and parallel I/O channels test vectors
The quality of GO/NOGO testing is maintained during conversion and the BST
diagnostics are transferred as an integrated part of the In-Circuit Test
program, or using the WildScan diagnosis capability.
Combined Boundary-Scan & ICT test strategies
Within a PCB production line that utilises In-Circuit test (ICT) and
Boundary-Scan test (BST) as the main production test strategy, a number of
combined test strategy options are possible, such as:
- Complete production test using two test stages on two independent testers.
With this solution the boards must at first be declared PASS on the ICT tester,
prior to being convoyed to the BST tester. This solution
requires two test fixtures (at additional expense), increases the production test time and is more
difficult to handle for high volume production.
- One Step Test using two test systems integrated within the same platform.
With this solution the BST tester is integrated within the ICT
tester. This hardware and most probably software integration, requires a
minimum of co-operation between the suppliers of BST and ICT testers.
- One step test on ICT test system. Taking into account the cost
of a BST tester and assuming that ICT testers resources are at least
equivalent regarding the performances requested, WildScan is innovative
solution for providing a one step test without the need for additional
Key product benefits
Simple software translation
Migration is provided by a simple software translation without the need for
any additional proprietary hardware to be integrated within the In-circuit tester.
WildScan converts Boundary-Scan parallel accesses into standard In-Circuit Channels.
Specific migration packages provided on request
The product portfolio currently consists of a Goepel translator, but additional
translators for other Boundary-Scan platforms, such as ASSET and JTAG Technologies
can be developed on request.
Specific file generation
Specific tester files have been developed for the following In-circuit testers; Agilent,
GenRad, IFR, Rhode & Schwarz, Schlumberger and Teradyne.
Industry Standard file generation
Industry Standard file formats are supported such as; EDIF 2.0 netlist, BSDL model,
JEDEC Wave and Serial Vector Format (SVF).
The WildScan migration software will operate on multiple platforms such as; PC, Sun/Sparc
Tell me more
- TPQR, Test Program Quality Report
- TestWay, Board testability analyzer
- QuadView, Next generation viewers
- Quad, Quality advisor and manager
- QuadFeederSafe, make your feeder settings secure